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  Product Center
Mica plate
Item No:ZD-GS2082
Description:ZD-GS2082 mica plate, mica plate is formed from mica paper with organosilicon glue, heating and pressing. The content of mica is about 90%, and the content of organosilicon glue is about 10%. Two kinds of mica board and gold cloud motherboard are commonly used. The muscovite and gold mica have good electrical and mechanical properties, good heat resistance, good chemical stability and corona resistance. The electrical properties of Muscovite are better than those of mica, but the Muscovite is soft and heat resistant, better than muscovite. Mica paper can also be compounded with metal material and made into mica composite board. It is a new excellent high-temperature sealing material, and is being developed and applied continuously.

Performance characteristics of mica plate:
It has high dielectric strength and resistance, low dielectric loss and excellent dielectric properties such as arc resistance and corona resistance.
? hard in texture and high in mechanical strength.
High temperature and temperature change
High acid resistance, alkali resistance and good chemical stability
Good heat resistance, non flammability and anticorrosion.

Mica board use: applicable to various industrial electric furnaces, industrial frequency furnaces, refining furnaces, medium frequency furnace, calcium carbide furnace, iron alloy, yellow phosphorus furnace, electric arc furnace, electric power plant, electrolytic aluminum frequency furnace, medium frequency furnace, electric arc furnace and other high temperature insulation and all kinds of electrical appliances, electric welding machines, lightning arresters, electric heating elements and so on. Flange sealing gasket.

Product code
Heat-resistant mica plate HP5-Z
Hea-resisting talc HP5
Mica paper
phlogopite
talc
adhesive
Organosilicon resin
Organosilicon resin
Mica content(%)
≥90%
≥90%
gum conte(%)
≤10%
≤10%
thinkness(mm)
0.10~2.0
0.10~2.0
Thickness error(mm)
Aberage
±0.02-±0.05
±0.02-±0.05
Each point
±0.05-±0.08
±0.05-±0.08
Density(g/cm3)
1.6-2.2
1.6-2.2
Heating reduction(%)
≤0.60
≤1.00
Bending strength(kgf/mm2)
≥16
≥18
Breakdown voltage(KV/mm)
>18
>20
Insulation resistance
100-600
200-600
Temperature
850℃
550℃
Size(mm)
1000×600 1000×1200
1000×600 1000×1200
Test standard
GB5019-85,IEC371
GB5019-85,IEC371
 
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